R9A06G037GNP#AA0
manufacturer:
Renesas Electronics America Inc
Description:
SOC PLC MODEM LSI SMART GRID ASS
Category:
Semiconductors
Specifications
Category:
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Product Status:
Active
Peripherals:
PWM
Primary Attributes:
-
Series:
-
Package:
Tray
Mfr:
Renesas Electronics America Inc
Supplier Device Package:
64-HVQFN (9x9)
Connectivity:
CSI, I²C, UART
Operating Temperature:
-40°C ~ 85°C (TA)
Architecture:
DSP, MCU
Package / Case:
64-VFQFN Exposed Pad
Number Of I/O:
16
RAM Size:
128KB
Speed:
138MHz
Core Processor:
ARM® Cortex®-M3
Flash Size:
-
Introduction
ARM® Cortex®-M3 System On Chip (SOC) IC - 138MHz 64-HVQFN (9x9)
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